Eitre® - Nano Imprint Lithography systems for Research & Development  

Eitre Nano Imprint Lithography systems for Research and Development
The Eitre® Nano Imprint Lithography (NIL) series offer a flexible and cost efficient lithography solution. The systems are suitable for Research & Development purposes allowing replication of patterns in the micro- and nanometer range.

Eitre® offers a complete range of imprint methods, including thermal NIL, hot embossing, UV NIL, as well as Obducat's proprietary Simultanous Thermal and UV (STU®) imprint process.

All Nano Imprint Lithography (NIL) systems from Obducat are equipped with full area thermal imprint, using the patented Soft Press® technology. The proprietary design of the heater, embedded in the substrate chuck, provides a homogeneous temperature distribution across the whole imprint area. The uniform heating and a wide range of temperature settings, makes it possible to use a wide range of imprint polymer.

Soft Press®

With Obducat Soft Press® technology pressure is applied to the stamp and substrate using compressed air, ensuring pressure uniformity over the entire imprint area. This allows stamp and substrate to conform to each other, eliminating negative effects from thickness variations, bow or waviness in stamp or substrate. Soft Press® enables thin and uniform residual layer over large areas, which is critical for high-resolution printing and pattern transfer fidelity.


The proprietary Simultaneous Thermal and UV (STU®) technology enables simultaneously combined thermal and UV nano imprint lithography, allowing the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. By using the unique STU® technology, problems related to thermal expansion mismatch between stamp and substrate are avoided. In the STU® process spin-coatable polymers are used, allowing control of the initial polymer thickness and homogeneity, essential for achieving thin and uniform residual layers.


The patented Intermediate Polymer Stamp (IPS®) technology enables contamination control and increases the master stamp lifetime through a two-step process where the contact between the master stamp and the target substrate is avoided. Instead, the master stamp is replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate.

  Eitre® 3 Eitre® 6 Eitre® 8
Imprint Area Up to 3" Up to 6" Up to 8"
Clean-room Compatibility Class 100 Class 100 Class 100

Computer Controlled User Interface

Option Standard Standard
Thermal Imprint Standard Standard Standard
UV Imprint Option Option Option
STU® Option Option Option
IPS® N/A Option Option
Water Cooling N/A Option Standard
Optical Alignment N/A Option Option
Substrate-Stamp separation unit N/A Option Option
HDD Configuration N/A Option N/A